Russia to launch packaging of Irtysh processors
Tramplin Electronics has signed a tripartite agreement with MIET and the Zelenograd Nanotechnology Center (ZNTC) to develop and implement a full‑cycle packaging technology for high‑performance microchips and multi‑processor modules. The packaging will cover Irtysh processors, which feature more than ten thousand interconnects per die and require complex flip‑chip assembly using BGA and LGA package types.
Packaging is a multi‑stage technological process that includes semiconductor wafer dicing, die mounting, encapsulating chips with special compounds, attaching a heat spreader lid, and forming external interconnects. According to the project participants, open sources contain no information about successful or mass‑scale packaging of chips of this complexity level in Russia, although some companies in the industry have individual developments in this area.
MIET's Laboratory of Advanced Packaging and 3D Microsystem Manufacturing, led by Denis Vertyanov, Candidate of Technical Sciences, heads the research segment. The scientists will develop design and technological solutions and adapt them to the materials and production capacities available in the country. The organisation and launch of serial processor assembly will take place at the new production facility of ZNTC.
According to the laboratory head, the Irtysh package design includes a thick heat spreader lid with a gold‑indium thermal interface, as well as multiple dies with an array of more than ten thousand copper pillar bumps coated with solder. This makes the packaging process technically challenging. Previous packaging attempts in Russia did not reach mass production. The new project aims to develop original methods for multi‑die assembly, thermal interface formation, and lid attachment. Materials not yet produced in Russia will be replaced with domestic equivalents currently under development with partner involvement.
Tramplin Electronics consider the collaboration with MIET and ZNTC a crucial step toward localising modern processor manufacturing in Russia. The project participants expressed confidence that the Irtysh will become the first domestically produced processor of this complexity level to undergo mass regular‑basis packaging in the country.
Source: Computerra